发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE: A wire bonding apparatus is provided to prevent vibration from being transferred, by making a moving unit properly guided while the moving unit can be locked in a wire bonding process. CONSTITUTION: A pair of gripper apparatuses hold the edge of a leadframe. The pair of gripper apparatuses are guided along a front rail(21) and a rear rail(22) which can approach each other or be separated from each other. The front and rear rails are mounted on a front moving unit(23) and a rear moving unit(24) which can approach each other or be separated from each other. One end of a guide(27) is fixed to a side of the front moving unit and the other end of the guide penetrates the rear moving unit. A roller(26) is installed in the rear moving unit, capable of rotating. A cylinder is installed in the rear moving unit. A cylinder rod extends or shrinks regarding the guide so that a contact part installed in the end of the cylinder rod can contact the guide. A driving unit makes the front and rear moving units approach each other or separated from each other.
申请公布号 KR20020078081(A) 申请公布日期 2002.10.18
申请号 KR20010017941 申请日期 2001.04.04
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 PARK, WON MYEONG
分类号 H01L21/60 主分类号 H01L21/60
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