| 摘要 |
PROBLEM TO BE SOLVED: To separately discharge gas and liquid in wafer development. SOLUTION: A cup housing portion 60 is provided on the bottom thereof with a bottom plate 61. The bottom plate 61 is provided with a drain port 62, and the upper face of the bottom plate 61 is inclined, so that the drain port 62 is positioned at the lowermost level. A cup 67, which encircles a wafer W during processing, is placed in the cup which houses the portion 60. An inclined plate 70, having substantially a conical shape, is placed on the bottom plate 61 inside the cup 67. The inclined plate 70 is provided with exhaust pipes 72, and an exhaust port 73s of the exhaust pipes 72 is positioned at a level higher than that of the inclined plate 70. Developing solution, flying out of a wafer W or similarly leaving the wafer W, flows on the bottom plate 61 and the inclined plate 70 and is discharged through the drain port 62, without flowing into the exhaust ports 73. Air supplied from an air supplying mechanism 95 located above goes through the cup 67 and is exhausted through the exhaust pipes 72. |
