| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can prevent peeling of soldering between a board and an outer lead, and cracks and burnout of the outer lead, by absorbing stress to the longitudinal direction of the outer lead, when stress is applied to the semiconductor device while the semiconductor device is being packaged. SOLUTION: A projection 3d is provided on the outer lead 3 of the semiconductor device 10. The projection 3d is formed, by allowing one portion of the outer lead 3 to project in nearly a vertical direction to the longitudinal direction of the outer lead 3 between the end face of a semiconductor package 2 and a contact section 3a for bending, thus expanding and contracting the outer lead 3 in the longitudinal direction of the outer lead 3 by elastic bend deformation, and absorbing the stress in the longitudinal direction of the outer lead 3 that is applied to the semiconductor 10.
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