| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer interconnection board, having connection reliability and a minute-diameter via hole, and to provide a method for manufacturing the multilayer interconnection board. SOLUTION: In the multilayer interconnection board where insulating and conductor wiring layers are laminated mutually, projections 2a and 2b are formed. At the projections 2a and 2b, a periphery section of a lower pad 1 in the via hole 6 for connecting the upper and lower conductor wiring layers is higher than a pad surface.</p> |
