| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing apparatus for a semiconductor device and a manufacturing method for a liquid crystal display device, which can suppress crackings due to heat strain of substrate and improve the throughput. SOLUTION: As for the manufacturing method for the semiconductor device which forms a semiconductor element on the substrate by an RTA method, preheating processes 304, 305, and 306 for heating the substrate 1 in stepwise manner are performed before the substrate 1 is heat-treated by the RTA method.</p> |
