| 摘要 |
PROBLEM TO BE SOLVED: To form a columnar electrode operating as a through hole conduction part on a film substrate by a method different from a plating processing. SOLUTION: A peeling layer 24, the film substrate having conductive layers for forming wiring 21 and 22, which are formed of copper foil, on both faces, a conductive layer 23 for forming columnar electrode 23, which is constituted of solder, copper and the like, are placed on the upper face of a lower metallic mold 27. When an upper metallic mold 25 is lowered, the conductive layer for forming columnar electrode 23 is punched by the projection 26 of the upper metallic mold 25. The film substrate 2 having the conductive layers for forming wiring 21 and 22 and the peeling layer 24 are punched by a columnar electrode 6 constituted of the punched piece. The punched pieces 29 are discharged from the through holes 28 of the lower metallic mold 27. Thus, a through hole 5 is formed in the film substrate 2 having the conductive layers for forming wiring 21 and 22 and the peeling layer 24, and the columnar electrode 6 is buried in the through hole 5. Then, the upper/lower faces of the columnar electrode 6 are pressurized and are arranged. Then, the peeling layer 24 is peeled off. |
