| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning a deposited film forming apparatus capable of efficiently removing by-product adhered in a reaction vessel and an exhaust pipe when depositing a film, shortening the cleaning time, and realizing mass production of the functional deposition film having excellent characteristics at a low cost. SOLUTION: In the cleaning method of the deposited film forming apparatus, ClF3 gas is introduced in the reaction vessel and the exhaust pipe to generate plasma for cleaning, the flow rate of ClF3 gas per unit volume to the total value of the capacity of the reaction vessel and the capacity of the exhaust pipe is set to be in a range of 2.5-50 [1.min<-1> (normal).m<-3> ].
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