| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a photo- semiconductor, excellent in transparency, solder resistance and releasing property, a method for producing the same and the photo-semiconductor device sealed by a cured material of the above composition. SOLUTION: This epoxy resin composition for sealing the photo- semiconductor, consisting of (A) an intermediate reaction product of an epoxy resin with a curing agent, (B) a curing accelerator, (C) an inorganic filler and (D) a releasing agent as essential ingredients, is characterized by a fact that the intermediate reaction material of the epoxy resin with the curing agent consists of (a) an epoxy resin consisting of triglycidyl isocyanulate and a bisphenol type epoxy resin, and (b) and acid anhydride, and is obtained by melting and mixing them without a solvent.
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