| 摘要 |
PURPOSE: A compound for chip thermistor elements and method for manufacturing chip thermistor using the same is provided to achieve improved reliability of chip thermistor by reducing deterioration of resistance value. CONSTITUTION: A compound for chip thermistor elements, comprises Mn 38 to 58 mole percent, Co 35 to 55 mole percent, Al 5 to 10 mole percent, and 0.01 to 5 parts weight of one selected from the group consisting of Nb2O5, Y2O5 or SiO2. A method for manufacturing a chip thermistor(10), comprises a first step of calcining a material containing Mn 38 to 58 mole percent, Co 35 to 55 mole percent, Al 5 to 10 mole percent; a second step of mixing the calcined material with 0.01 to 5 parts weight of one selected from the group consisting of Nb2O5, Y2O5 or SiO2; a third step of making the mixture into a slurry, and forming the slurry into a sheet; a fourth step of forming internal electrodes(13,14) on the sheet, pressing sheets which are alternately stacked into a layer, and calcining the resultant structure; a fifth step of sintering the calcined structure; and a sixth step of forming external electrodes(15,16) at both outer sides of the sintered structure, in such a manner that external electrodes are electrically connected to internal electrodes.
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