| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semiconductor device, having a built-in terminal for test that can easily evaluate the operation condition of a semiconductor device unit on a packaging substrate. SOLUTION: The semiconductor device with the built-in terminal has plural subleads 13, that are provided at the upper section of a silicon chip 2 at nearly the same height from a glass epoxy substrate 1, and are connected to pads for external connection and evaluation analysis in the silicon chip 2 via an Au line wire 12, and an upper resin mold section 14, that is formed for covering the silicon chip 2 and the plural subleads 13 without exposure. The upper resin mold section 14 is polished until the subleads 13 are exposed, thus easily evaluating the operation condition of the semiconductor device unit on the packaging substrate.</p> |
