| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board, a manufacturing method thereof, and a semiconductor device, wherein no manufacturing process is complicated, with high reliability in interlayer connection and mechanical strength. SOLUTION: Conductor bumps 2 are allowed to penetrate a pre-preg by pressurizing a conductor layer in which the conductor bumps 2 where a conductive paste is molded into a conical shape are provided on a non-cured insulating material substrate 3 such as epoxy, to form an electrical continuity in the thickness direction of the insulating material substrate 3. Patterning is performed after a resin of a resin-fitted copper foil 4 through which the conductor bumps 2 penetrate is entirely cured. An adhesive 17 is applied over the entire surface of the insulating material substrate 3 on the tip sides of the penetrating conductor bumps 2, to provide a substrate unit 18. By integrally working with the substrate unit 18 in which patterning for all layers of multilayer substrate is completed at one lamination press, a multilayer substrate is formed.</p> |
