| 摘要 |
PROBLEM TO BE SOLVED: To stably and speedily perform work by decreasing the loss of wafers, to accelerate the switching speed of wafers and to eliminate a separate cleaning process. SOLUTION: This device is provided with a reaction chamber, equipped with a cassette station 16 in the atmosphere, atmospheric carrier robot 10 for drawing a wafer in the cassette station 16, load lock chamber 12 for storing the wafer drawn by the atmospheric carrier robot 10, a shuttle blade, which is communicated with the load lock chamber 12, for drawing out the wafer stored in the load lock chamber 12 in a vacuum state and storing a wafer 18, to which etching treatment is re-applied, into the load lock chamber 12, rotary robot 26 for rotating and moving the wafer 18 drawn out of the load lock chamber 12 and placed on the shuttle blade, and heater stage 24 for etching the wafer 18 rotated and moved by the rotary robot 26 by a plasma generator. |
