ULTRA-THIN FILM PACKAGE

摘要

PURPOSE: An ultra-thin-film package is provided to remarkably reduce the thickness of a whole package by forming a die carrier while using a polymer thin film or a polyimide(PI) layer and by using an ultra thinness property and high density characteristic of the PI die carrier inside the polymer thin film or the package. CONSTITUTION: A polymer thin film die carrier(or a substrate) or a PI die carrier(or a substrate)(1) is used. A leg position for die bonding is formed of a recess shape to reduce the thickness of the package after a bonding process. The polymer thin film die carrier(or the substrate) or the PI die carrier(or the substrate) is formed of a thin film shape through a chemical etching method or a laser fabrication method. An input/output leg position(12) is formed of a recess shape and is changed by using a package material(4) after a die(2) is attached to the polymer thin film die carrier(or the substrate) or the PI die carrier(or polymer). A single package granule including the die is sawed through a dicing process. The polymer thin film die carrier(or the substrate)/the PI die carrier(or the substrate) and the die are soldered to one end of an interconnection(21), and a metal pad(13) in the leg position of a recess shape formed on the polymer die thin film carrier(or the substrate) or the PI die carrier(or the substrate) is soldered to the other end of the interconnection. The electrode of the metal pad protrudes from the back surface of the polymer thin film die carrier(or the substrate) or the PI die carrier(or the substrate).