| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board capable of forming a fine conductor pattern of good shape, without degradation in productivity. SOLUTION: A conductor layer transfer sheet 31 is used where a transfer copper foil 32 is releasably held on a carrier copper foil 33 which is thicker than it. The transfer copper foil 32 is transferred and pasted to at least one surface of an insulating base material 4 through a pre-preg 34, to form a copper base material layer 6. A mask 11 is formed on the copper base material layer 6, and copper plating layers 7 and 8 are formed at a place exposed from its opening part 12. Then etching is performed after the mask 11 is removed, and the copper base material 6 is removed to separate conductor patterns 2b from each other.</p> |
