发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND MANUFACTURING DEVICE FOR SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device which can manufacture a semiconductor device having small curvature. SOLUTION: Through epitaxial growth, a 1st semiconductor multilayered film 130 is formed on the top surface of a substrate 101 for crystal growth, and a 2nd semiconductor multilayered film 150 is formed on the reverse surface of the substrate 130.
申请公布号 JP2002305144(A) 申请公布日期 2002.10.18
申请号 JP20010107008 申请日期 2001.04.05
申请人 SEIKO EPSON CORP 发明人 NISHIDA TETSURO
分类号 H01L21/205;H01L21/02;H01L21/20;H01S5/183;(IPC1-7):H01L21/20 主分类号 H01L21/205
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