| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the yield of a semiconductor device. SOLUTION: The semiconductor device is composed of a tab, where a semiconductor chip is mounted, a sealing section 3 comprising a body-sealing section 3b for sealing the semiconductor chip by resin and a circumference-sealing section 3c formed at a circumference section, plural leads 1a arranged side by side at the circumference section on a back at the sealing section 3, while a surface to be connected is being exposed; and a tab suspension lead 1e. In the plural leads 1a, the tab suspension lead 1e arranged at the corner section of the body-sealing section 3b is widely formed; and at the same time the side of the tab suspension lead 1e is formed, while being in parallel to the side of the adjacent lead 1a opposite to the side, thus preventing the formation of the circumference-sealing section 3c that is made of resin and is arranged at a corner edge section over both the sides at the corner section of the body- sealing section 3b; and hence increasing strength in the circumference-sealing section 3c arranged near the corner section of the body-sealing section 3b for improving the yield of a QFN 5.</p> |
