| 摘要 |
<p>PROBLEM TO BE SOLVED: To display a faulty semiconductor device on a package, to remove the faulty semiconductor device before a selection process, and to manufacture a semiconductor device efficiently at a low cost. SOLUTION: An image in a device region 8a on a multiple machining substrate 8 where wire bonding is completed is taken in, and a faulty device region is detected by inspecting the misalignment of a semiconductor chip, the presence or the absence of the semiconductor chip, the improper connection and disconnection of bonding wire, or the like. After that, a batch mold section 9 is formed by collective molding, and a fault mark FM is marked onto the surface of the batch mold section 9, where the detected faulty device region 8a is positioned. Then, a soldering bump is formed in an electrode for connection, that is formed on the back of the multiple machining substrate 8, and the batch mold section 9 is divided into pieces by dicing, thus completing the semiconductor device. The semiconductor device with the faulty mark FM is eliminated in advance, and only a conforming semiconductor device is selected for inspecting.</p> |
