摘要 |
PROBLEM TO BE SOLVED: To provide a composite cluster which is most suitable for use in obtaining a sound wiring structure having no defective, by reliably embedding a wiring metal having high purity in the inside of a fine recessed part for wiring formation, provided on the surface of a substrate. SOLUTION: The composite cluster has a structure, in which a metal cluster 28 is surrounded by gas molecules 30 or a gas cluster. The composite cluster is manufactured, in such a way that a metal 24 is evaporated and condensed to form the metal cluster 28, and the gas molecules 30 or the gas cluster are adhered by the van der waals force.
|