发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, capable of sufficiently assuring etching resistance as a mask material and accurately working a member to be worked. SOLUTION: The method for manufacturing the semiconductor device comprises a step of forming the mask material 105, having an aromatic ring and containing a content of a carbon atom of 80 wt.% or more on a member 104 to be worked, a step of forming a mask material pattern 105 by etching the material 105 in a desired pattern, and a step of etching the member 104 with the mask material pattern 105 as a mask.
申请公布号 JP2002305187(A) 申请公布日期 2002.10.18
申请号 JP20010381504 申请日期 2001.12.14
申请人 TOSHIBA CORP 发明人 OUCHI JUNKO;SATO YASUHIKO;SHIOBARA HIDESHI;HAYASHI HISATAKA;OIWA NORIHISA;ONISHI KIYONOBU
分类号 G03F7/075;B05D1/32;B05D7/00;G03F7/11;G03F7/38;G03F7/40;H01L21/027;H01L21/28;H01L21/302;H01L21/3065;H01L21/3213;H01L21/768 主分类号 G03F7/075
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