| 摘要 |
PROBLEM TO BE SOLVED: To provide a component packaging device capable of efficiently and surely delivering and discharging a substrate, on which a film-like electronic component is packaged, without dropping the electronic component or damaging the substrate. SOLUTION: A substrate conveyance unit 10 has a conveyance stage 11 and a lift pin 14 for carrying up a glass substrate 31 to be conveyed by the conveyance stage 11. A discharge unit 16 has a discharge table 17, inserted in the space between the glass substrate carried up by the lift pin 14 and the conveyance stage 11. The discharge unit 16 is provided with a protruding part 17a for supporting the glass substrate 31 from the lower surface side thereof and a support member 18 for supporting a film-like electronic component 32, which is packaged at the edge of the glass substrate 31 from the lower surface side thereof. A hang unit 15 hangs up the film-like electronic component 32, which is positioned on the inserting side of the discharge table 17, in the film- like electronic component 32, when inserting the discharge table 17 between the glass substrate 31 and the conveyance stage 11.
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