| 摘要 |
1,189,062. Semi-conductor devices. MOTOROLA Inc. 11 March, 1968 [23 March, 1967], No. 11780/68. Heading H1K. In a semi-conductor rectifier assembly comprising two radially flanged metal, e.g. Cu, discs 10, 11, soldered to a semi-conductor wafer 14, the annular recess defined by the discs 10, 11 and the wafer 14 is filled with silcone rubber 16, and the flanges 12, 13 and rubber 16 are surrounded by a moulded jacket 17 of plastics material. Faces 18 of the discs 10, 11 remain exposed. Projections 19 are provided on each flange 12, 13 to stabilize the assembly against relative rotation of the parts. The silicone rubber 16 may be applied, prior to formation of the jacket 17, by pressure moulding or by means of a hypodermic needle while in a thinned condition. |
