发明名称 SPUTTERING METHOD AND SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To determine the optimum discharge start point of time for producing non-defective disks for rotating bodies, even when the time required for the consistent discharge is different, when different films are laminated for deposition, when the conditions are different such as the power source and the vacuum pressure for discharge, and when the conditions are changed for deposition such as vacuum pressure and the output of the power source. SOLUTION: The output command 10 of the power is output to the power source while measuring the actual rotating speed of the body 4, the feedback value of the output power from the power source is captured, the time required before the discharge is consistent is automatically measured a plurality of times, the discharge start position corresponding to the absolute position of the rotating body is automatically operated, and the output command 10 of the power of the power source 8 is output when the rotating body arrives at the position.
申请公布号 JP2002302765(A) 申请公布日期 2002.10.18
申请号 JP20010109593 申请日期 2001.04.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KITAI TAKAHIRO;SUEMITSU TOSHIYUKI
分类号 C23C14/34;G11B7/26;(IPC1-7):C23C14/34 主分类号 C23C14/34
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