发明名称 DIRECT-ACTING DEVICE AND WAFER PROCESSOR PROVIDED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To suppress the leak of dust, which is generated inside a case by the pressure increase of atmosphere inside the case with the movement of a moving member to the outside. SOLUTION: This direct-acting device has a direct-acting mechanism 3 for making a moving member 2 reciprocate vertically. A case 4 for housing the direct-acting mechanism 3 is formed with a longitudinal slit 45 for movably protruding a link part 1, which is one part of the moving member 2, outward. A known seal means (not shown) is applied to the slit 45. An exhaust pipe 5 for exhausting the atmosphere inside the case 4 is connected to a base wall 46 of the case 4. An upper surface wall 48 of the case 4 is provided with an air hole 6 with a filter 60, capable of capturing dust generated inside the case 4. The pressure of the atmosphere inside the case to be compressed with the movement of the moving member 2 is released from the air hole 6.
申请公布号 JP2002305230(A) 申请公布日期 2002.10.18
申请号 JP20010109903 申请日期 2001.04.09
申请人 TOKYO ELECTRON LTD 发明人 YAMAGUCHI EIJI
分类号 H01L21/677;H01L21/304;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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