发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To make the processing of a substrate uniform. SOLUTION: A rotary housing 2 is provided rotatably in a housing 1, and a rotary driving device 3 which rotates the rotary housing 2 is provided; and a platform 4 is provided at the upper part of the rotary housing 2, and a substrate 5 is supported on the platform 4. In a processing state, the heating temperature of a lamp heating device 11 is held at, for example 1,000 deg.C and in a conveyance stage, the substrate is conveyed, while the lamp heating device 11 is placed in operation.
申请公布号 JP2002305158(A) 申请公布日期 2002.10.18
申请号 JP20010109870 申请日期 2001.04.09
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SHINOZAKI KENJI
分类号 H01L21/677;H01L21/26;H01L21/68;(IPC1-7):H01L21/26 主分类号 H01L21/677
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