| 摘要 |
PURPOSE: Provided is a high molecular resin composition which has high heat resistance temperature suitable to ion beam or ion implantation and durability, and which is excellent in dimensional stability. CONSTITUTION: The resin composition consists of one or more resin selected from the group consisting of polyphenylene oxide, polycarbonate, polybutylene terephthalate, polysulfone, polyethylene terephthalate, polyether sulfone, polyphenylene sulfide, polystyrene, acrylobutadiene styrene resin, polyetherimide, polyamide, polymethylmethacrylate, acetal resin, polyethylene, polypropylene, styrene butadiene rubber, ethylene propylene rubber, and EPDM rubber. The resin composition further comprises 0.01-50 wt% of glass fiber.
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