发明名称 ORIENTATION-INDEPENDENT THERMOSYPHON HEAT SPREADER
摘要 Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28) in hydraulic communication with a peripheral condenser (30), both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator (28) substantially full at all orientations while leaving a void for accumulation of vapor in the condenser (30). A cover plate (24) and a parallel base plate (22) of generally similar dimension form the evaporator (28) and condenser (30). Optionally, an opening in the base plate (22) is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate (22) may be formed with the electronics package from a single piece of material. A boiling enhancement structure (34)is provided in the evaporator (30) to encourage vapor bubble nucleation.
申请公布号 WO02081996(A2) 申请公布日期 2002.10.17
申请号 WO2002US10110 申请日期 2002.04.03
申请人 UNIVERSITY OF MARYLAND, COLLEGE PARK 发明人 JOSHI, YOGENDRA;MURTHY, SUNIL, S.;NAKAYAMA, WATARU
分类号 F28D15/02;F28F13/18;H01L23/427 主分类号 F28D15/02
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