| 摘要 |
<p>A thermoelectric cooling and heating device (1) including a substrate (1), a plurality of thermoelectric elements (2) arranged on one side of the substrate and configured to perform at least one of selective heating and cooling such that each thermoelectric element (2) includes a thermoelectric material (2b), a Peltier contact (2c) contacting the thermoelectric and forming under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material (2b)and the Peltier contact (2c). As such, the thermoelectric cooling and heating device (1) selectively biases the thermoelectric elements (2) to provide on one side of the thermoelectric device (1) a grid of localized heated or cooled junctions.</p> |
