发明名称 |
Forming a dielectric layer by thermal decomposition of a metallo-organic material |
摘要 |
A method of forming a dielectric layer on a substrate, including the steps of providing a metallo-organic material in a solvent, which dissolves such metallo-organic material; coating dissolved metallo-organic material onto the substrate to form a layer; and heating the deposited layer in an oxygen environment to produce thermal decomposition of the organic component of the dissolved metallo-organic material and a reaction of the metallic portion of the material with oxygen thereby causing the layer to become dielectric.
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申请公布号 |
US2002151439(A1) |
申请公布日期 |
2002.10.17 |
申请号 |
US20010793299 |
申请日期 |
2001.02.26 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
BLANTON THOMAS N.;CHATTERJEE DILIP K.;CARLTON DONN B. |
分类号 |
C23C18/12;H01G4/14;H05K1/16;H05K3/10;(IPC1-7):H01B1/00 |
主分类号 |
C23C18/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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