发明名称 Forming a dielectric layer by thermal decomposition of a metallo-organic material
摘要 A method of forming a dielectric layer on a substrate, including the steps of providing a metallo-organic material in a solvent, which dissolves such metallo-organic material; coating dissolved metallo-organic material onto the substrate to form a layer; and heating the deposited layer in an oxygen environment to produce thermal decomposition of the organic component of the dissolved metallo-organic material and a reaction of the metallic portion of the material with oxygen thereby causing the layer to become dielectric.
申请公布号 US2002151439(A1) 申请公布日期 2002.10.17
申请号 US20010793299 申请日期 2001.02.26
申请人 EASTMAN KODAK COMPANY 发明人 BLANTON THOMAS N.;CHATTERJEE DILIP K.;CARLTON DONN B.
分类号 C23C18/12;H01G4/14;H05K1/16;H05K3/10;(IPC1-7):H01B1/00 主分类号 C23C18/12
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