Cleaning apparatus in a stencil printer

摘要

An apparatus and method for cleaning excess solder paste that is deposited on a stencil in a stencil printer. The apparatus includes a solvent bath containing a pool of solvent in which a bar is disposed in the solvent bath. The bar rotates in the solvent bath and surface tension between the bar and the solvent causes the solvent to uniformly adhere to the bar. The bar is used to apply solvent to a cleaning material that is used to wipe excess solder paste from the stencil.