WINDOWS USED IN THERMAL PROCESSING CHAMBERS

摘要

An apparatus for heat treating semiconductor wafers (14) in a thermal processing chamber (12) using light energy is provided. In one embodiment, the apparatus contains a window (32) located between the semiconductor wafer and the energy source (24). The window contains a member that defines at least one passage capable of being placed into communication with a coolant to cool the window and at least partially offset the "first wafer effect". Additionally, in some embodiments, the window has a thickness greater than about 1 inch so that it can withstand pressures applied during wafer processing.