发明名称 |
Installation substrate, method of mounting installation substrate, and bulb socket using installation substrate |
摘要 |
A mounting board has a board, retaining members mounted on the upper surface of the board, and a part retained by the retaining members. The part is mounted such that at least a part thereof is arranged below the lower surface of the board, and that the part is electrically connected to the board through the retaining members. Such an arrangement as described above eliminates the need of connecting the discharge gap element to the board by using lead wires, and of mounting it on the upper surface of the board. This lowers the height of the board and admits an elevated part.
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申请公布号 |
US2002148641(A1) |
申请公布日期 |
2002.10.17 |
申请号 |
US20020110678 |
申请日期 |
2002.04.16 |
申请人 |
MINAMI FUMIHIRO;YAMASAKI YUKARI;SEKIYA MUTSUO |
发明人 |
MINAMI FUMIHIRO;YAMASAKI YUKARI;SEKIYA MUTSUO |
分类号 |
H01R33/76;H01R33/945;H01R33/975;H05K3/30;(IPC1-7):H05K1/16;H01R12/04;H05K3/34 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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