发明名称 |
Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate |
摘要 |
A method and apparatus for providing power from a first circuit board to a second circuit board is disclosed. The apparatus comprises a flex circuit having a plurality of conductive paths formed by a plurality of first conductive areas electrically coupled to a plurality of second conductive areas wherein the plurality of first conductive areas permanently and electrically coupled to a plurality of first circuit board conductive pads and the plurality of second conductive areas disconnectably and electrically coupleable to at least one second circuit board conductive pad.
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申请公布号 |
US2002151195(A1) |
申请公布日期 |
2002.10.17 |
申请号 |
US20020147395 |
申请日期 |
2002.05.16 |
申请人 |
INCEP TECHNOLOGIES, INC. |
发明人 |
DIBENE JOSEPH TED;HARTKE DAVID H. |
分类号 |
G06F1/18;H01L23/427;H01L23/433;H01R4/64;H01R12/16;H05K1/02;H05K1/14;H05K3/30;H05K3/36;H05K7/10;H05K7/20;(IPC1-7):H05K1/00 |
主分类号 |
G06F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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