发明名称 Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
摘要 A method and apparatus for providing power from a first circuit board to a second circuit board is disclosed. The apparatus comprises a flex circuit having a plurality of conductive paths formed by a plurality of first conductive areas electrically coupled to a plurality of second conductive areas wherein the plurality of first conductive areas permanently and electrically coupled to a plurality of first circuit board conductive pads and the plurality of second conductive areas disconnectably and electrically coupleable to at least one second circuit board conductive pad.
申请公布号 US2002151195(A1) 申请公布日期 2002.10.17
申请号 US20020147395 申请日期 2002.05.16
申请人 INCEP TECHNOLOGIES, INC. 发明人 DIBENE JOSEPH TED;HARTKE DAVID H.
分类号 G06F1/18;H01L23/427;H01L23/433;H01R4/64;H01R12/16;H05K1/02;H05K1/14;H05K3/30;H05K3/36;H05K7/10;H05K7/20;(IPC1-7):H05K1/00 主分类号 G06F1/18
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