Coils integrated in IC-package

摘要

Method for providing at least one inductance associated with a chip attached to a support, in which said inductances are provided by means of at least a first bondwire having first and second ends. In which method said first end of said first bondwire is bonded to a first pad on said chip by means of an automated process using the chip as a reference for placing the first end of the first bondwire on the first pad when bonding it thereto. The second end of said first bondwire is bonded to a second pad on said support by means of the automated process using the chip as a reference for placing the second end of the first bondwire on the second pad when bonding it thereto.