发明名称 |
Structure and method for forming a multilayered structure |
摘要 |
Improved methods for forming multilayer circuit structures are disclosed. In some embodiments, conductive layers, dielectric layers and conductive posts can be formed on both sides of a circuitized core structure. The conductive posts are disposed in the dielectric layers and can be stacked to form a generally vertical conduction pathway which passes at least partially through a multilayer circuit structure. The formed multilayer circuit structures can occupy less space than corresponding multilayer circuit structures with stacked via structures.
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申请公布号 |
US2002150838(A1) |
申请公布日期 |
2002.10.17 |
申请号 |
US20020126334 |
申请日期 |
2002.04.19 |
申请人 |
ZHANG LEI;JIANG HUNT HANG |
发明人 |
ZHANG LEI;JIANG HUNT HANG |
分类号 |
H01L21/48;H05K3/00;H05K3/10;H05K3/24;H05K3/46;(IPC1-7):G03F7/26 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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