| 摘要 |
The invention relates notably to an integrated microwave module comprising a conductive ground plane, a non-conductive substrate on the ground plane, at least two microwave circuits mounted on the substrate, a microstrip line between the microwave circuits mounted on the substrate, and a conductive cover closing the integrated microwave module, According to the invention, the substrate comprises a line of metallized holes along the microstrip line on both sides of the microstrip line and a strip of conductive paste is disposed between the lines of metallized holes and the conductive cover.
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