Wave soldering process used in the production of printed circuit boards comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties

摘要

Wave soldering process comprises using a lead-free solder having a lower melting point than a usual tin-lead solder, and a fluxing agent having no-clean properties. Preferred Features: The lead-free solder is an alloy containing tin and bismuth as the main components containing 30-60, preferably 50-60% bismuth. The alloy further contains alloying additions of 0-4% silver, 0-4% antimony, 0-2% indium, 0-0.01% phosphorus and/or 0-0.2% nickel. The fluxing agent is ethanol or isopropanol with additions of carboxylic acid and/or dicarboxylic acid.