| 发明名称 |
Method for making an electrical circuit board |
| 摘要 |
A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.
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| 申请公布号 |
US2002148809(A1) |
申请公布日期 |
2002.10.17 |
| 申请号 |
US20010836644 |
申请日期 |
2001.04.17 |
| 申请人 |
GLOVATSKY ANDREW Z.;BELKE ROBERT E.;LI DELIN;GOENKA LAKHI N.;PARUCHURI MOHAN R.;STRAUB MARC A.;MCMILLAN RICHARD K.;RAGHAVA RAM S.;KRAUTHEIM THOMAS B.;HOWEY MICHAEL A.;JAIRAZBHOY VIVEK A. |
发明人 |
GLOVATSKY ANDREW Z.;BELKE ROBERT E.;LI DELIN;GOENKA LAKHI N.;PARUCHURI MOHAN R.;STRAUB MARC A.;MCMILLAN RICHARD K.;RAGHAVA RAM S.;KRAUTHEIM THOMAS B.;HOWEY MICHAEL A.;JAIRAZBHOY VIVEK A. |
| 分类号 |
H05K3/06;H05K3/40;H05K3/46;(IPC1-7):H01B13/00 |
主分类号 |
H05K3/06 |
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