发明名称 |
Semiconductor element test apparatus, and method of testing semiconductor element using the apparatus |
摘要 |
In a semiconductor element test apparatus and a method of testing a semiconductor element using the apparatus, a plurality of probe needles are brought into contact with semiconductor elements fabricated on a semiconductor wafer, and a structure is provided for attaching a probe card and a reinforcement member to a probe card hold member. In a plurality of mount positions in which a probe card substrate and a reinforcement member are attached to a probe card hold member, counterbores are formed so as to assume substantially the same depth and shape. Analogous mount structures are realized at a plurality of mount positions by way of the counterbores.
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申请公布号 |
US2002149385(A1) |
申请公布日期 |
2002.10.17 |
申请号 |
US20010973049 |
申请日期 |
2001.10.10 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MIKI KAZUNOBU |
分类号 |
G01R31/26;G01R1/06;G01R31/28;H01L21/66;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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