| 摘要 |
<p>A semiconductor device for reducing the inductance of a wiring for bridge-connecting a semiconductor switch and for miniaturization. An insulating board (15a) is formed by the interlamination of two bridge-connected controllable semiconductor switches (13a, 13b), output terminals, positive/negative electrode DC terminals (2, 3), conductor layers (12, 17, 19) having a conductor section for bridge-connecting a semiconductor switch between DC terminals on the surface and inside, and insulating layers (16, 18). The surface and inside conductor layers (12, 17) which sandwich the insulating layer (16) are electrically connected with a conductor (20) passing through the insulating layer (16) sandwiched by the surface and inside conductor layers (12, 17). Thus, a current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating board to flow in opposite directions between the conductor layers (12, 17) which sandwich the insulating layer (16)</p> |
