发明名称 Chip resistor fabrication method
摘要 A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer are cut in this order. To prevent the breakage of the substrate during the cutting, the resin layer has better machinability than the substrate.
申请公布号 US2002148106(A1) 申请公布日期 2002.10.17
申请号 US20020121715 申请日期 2002.04.15
申请人 TSUKADA TORAYUKI;KURIYAMA TAKAHIRO 发明人 TSUKADA TORAYUKI;KURIYAMA TAKAHIRO
分类号 H01C17/06;H01C7/00;H01C17/00;(IPC1-7):H01C17/00;B23P17/00;H05K3/36 主分类号 H01C17/06
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