ANTI-SCAVENGING SOLDERS FOR SILVER METALLIZATION

摘要

Solder and a method of manufacturing the solder are disclosed wherein powdered free silver (15) is added to a solder alloy (12) with a particle size sufficient to preserve silver metallization during use and with a concentration sufficient to maximize the effectiveness and avoid adverse effects on solder reflow characteristics. Preferably, the particle size is in a range of approximately 5 µm to 20 µm and the powdered free silver is added in a concentration of approximately 5% to 10%.