发明名称 PATTERNING METHOD
摘要 A patterning method comprises selectively depositing droplets of a first material solvent solution onto a layer of a second material. The solvent is chosen to dissolve both materials, which are selected so as to exhibit phase separation upon the removal of the solution to provide domains of the first material embedded in and extending through the second material. By selection of appropriate materials the patterning method may be used, for example, to fabricate light emitting devices, optical colour filters, or vertical interconnects in electronic devices.
申请公布号 WO02082561(A1) 申请公布日期 2002.10.17
申请号 WO2002GB01483 申请日期 2002.03.28
申请人 SEIKO EPSON CORPORATION;CAMBRIDGE UNIVERSITY TECHNICAL SERVICES LIMITED;KAWASE, TAKEO 发明人 KAWASE, TAKEO
分类号 H05B33/10;G09F9/00;G09F9/30;H01L27/32;H01L51/00;H01L51/05;H01L51/30;H01L51/40;H01L51/50;H05B33/02;H05B33/12;H05B33/22;H05B33/26 主分类号 H05B33/10
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