IC SOCKET

摘要

An IC socket which is prepared by forming a thermoplastic resin composition comprising 40 to 94 mass % of a thermoplastic resin, 5 to 30 mass % of a carbon precursor having a volume resistivity of 10<2> to 10<10> OMEGA cm and 1 to 30 mass % of an electrocondu ctive filler having a volume resistivity of less than 10<2> OMEGA cm. The IC socket is able to exhibit a surface resistivity which is strictly controlled to a desired level, and is excellent in electrically insulating property, mechanical properties, thermal resistance, chemical resistance, dimensional stability and the like.