发明名称 |
Carrier head for a chemical mechanical polishing apparatus |
摘要 |
A chemical mechanical polishing (CMP) device carrier head (54) utilizing a pressure pack (58) for transferring a polishing force (D) to a wafer (15) being polished. The pressure pack may include a silicon gel material (60) encapsulated within a sealed urethane casing (62). The pressure pack provides a desired fluid coupling in the polishing force load path, allowing the carrier head to function as a front side floating reference polishing apparatus. The pressure pack may include a plurality of casings (70, 72) defining a plurality of chambers (66, 68) in order to affect the distribution of pressure across an abutting pressure plate (56, 65).
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申请公布号 |
US2002151260(A1) |
申请公布日期 |
2002.10.17 |
申请号 |
US20010834205 |
申请日期 |
2001.04.12 |
申请人 |
CREVASSE ANNETTE MARGARET;EASTER WILLIAM GRAHAM;MAZE, JOHN ALBERT;MICELI FRANK |
发明人 |
CREVASSE ANNETTE MARGARET;EASTER WILLIAM GRAHAM;MAZE, JOHN ALBERT;MICELI FRANK |
分类号 |
B24B41/06;(IPC1-7):B24B5/00 |
主分类号 |
B24B41/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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