Electronic power component comprises a semiconductor chip having contact surfaces of source contacts on its active surface and a gate contact

摘要

Electronic power component comprises a semiconductor chip (2) having contact surfaces (4) of source contacts (50) on its active surface (3) and at least one gate contact (60). The rear side (7) has a common contact (8) for all drain regions as drain contact (9) of the power component. A coating (10) preventing metal diffusion and metallic thermo-sonic compression heads (12) for contacting inner flat conductors (11). The heads are connected to common source external connections (13) and a gate external connection (14). An Independent claim is also included for a process for the production of an electronic power component. Preferred Features: The compression heads are connected to gate electrodes and source electrodes via the contact surfaces and a structured conducting path layer (15) on the active surface side of the chip.