| 摘要 |
A method of manufacturing a compound semiconductor wafer with less adhesion of particles, surface oxidization, and deterioration and reducing the consumed amount of organic solvent, comprising the steps of sticking a suction pad on a polishing plate, polishing a wafer in the sucked state onto the suction pad without using wax, and storing the wafer in pure water without drying, wherein, since the wafer is stored in the pure water, the adhesion of particles, surface oxidization, and deterioration become less, and the high quality wafer can be obtained, the cleaning of the organic solvent being eliminated in a cleaning process after the storage in water, whereby the consumed amount and waste amount of the harmful organic solvent can be reduc ed.
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