发明名称 Abrasive and boring method using the same
摘要 <p>The present invention relates to an abrasive that decreases the heat generation by a core bit due to boring and allows the boring of a deep hole while maintaining the boring speed even when a deep hole is cut using a dry method. This abrasive contains abrasive grains, particles of anhydrous silica having a particle diameter from 5nm to 50nm and silanol groups in the surface thereof or abrasive grains and hydrous resin which discharges water when the hydrous resin is pressed by a core bit or the temperature of the hydrous resin rises, or abrasive grains and a sublimate. The abrasive (51) is supplied between the distal end of a rotating core bit (11) and a working material (20). <IMAGE></p>
申请公布号 EP1249481(A2) 申请公布日期 2002.10.16
申请号 EP20020008102 申请日期 2002.04.10
申请人 MITSUBISHI MATERIALS CORPORATION;NIPPON DIAMOND CO., LTD. 发明人 MAZAKI, SHIGERU;KAWAHARA, TSUYOSHI
分类号 B24D3/04;B24B53/013;B28D1/02;B28D1/04;B28D1/14;C09K3/14;(IPC1-7):C09K3/14 主分类号 B24D3/04
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