发明名称 |
Abrasive and boring method using the same |
摘要 |
<p>The present invention relates to an abrasive that decreases the heat generation by a core bit due to boring and allows the boring of a deep hole while maintaining the boring speed even when a deep hole is cut using a dry method. This abrasive contains abrasive grains, particles of anhydrous silica having a particle diameter from 5nm to 50nm and silanol groups in the surface thereof or abrasive grains and hydrous resin which discharges water when the hydrous resin is pressed by a core bit or the temperature of the hydrous resin rises, or abrasive grains and a sublimate. The abrasive (51) is supplied between the distal end of a rotating core bit (11) and a working material (20). <IMAGE></p> |
申请公布号 |
EP1249481(A2) |
申请公布日期 |
2002.10.16 |
申请号 |
EP20020008102 |
申请日期 |
2002.04.10 |
申请人 |
MITSUBISHI MATERIALS CORPORATION;NIPPON DIAMOND CO., LTD. |
发明人 |
MAZAKI, SHIGERU;KAWAHARA, TSUYOSHI |
分类号 |
B24D3/04;B24B53/013;B28D1/02;B28D1/04;B28D1/14;C09K3/14;(IPC1-7):C09K3/14 |
主分类号 |
B24D3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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