| 摘要 |
<p>An RF module (10) comprises a multi-layered substrate (12) having first and second side surfaces; a base-band IC (14) and a memory IC (16) mounted on the first side surface and an RF-IC (26) mounted on the second side surface. An RF passive component (36) is formed internally of the substrate (12), and a wiring pattern (32) is incorporated in the substrate (12), the wiring pattern interconnecting the base-band IC (14) and the memory IC (16). A shielding ground electrode pattern (38) is formed internally of the substrate (12), interposed between the first and second surfaces. An antenna may also be included in the substrate. The module provides a compact unit for use in communication devices such as a mobile phone.</p> |
