| 摘要 |
A method for fabricating a capacitor of a semiconductor device, includes providing a semiconductor substrate, forming a polysilicon layer pattern on the semiconductor substrate, forming a first HSG structure on an inner surface of the polysilicon layer pattern, forming a second HSG structure on the first HSG structure and an outer surface of the polysilicon layer pattern to produce a lower electrode of the capacitor, forming a dielectric film on the second HSG structure, and forming an upper electrode on the dielectric film.
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