发明名称 |
Rework and underfill nozzle for electronic components |
摘要 |
A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
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申请公布号 |
US6464125(B2) |
申请公布日期 |
2002.10.15 |
申请号 |
US20010783642 |
申请日期 |
2001.02.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COX WILTON L.;POOLE JOSEPH D.;SLESINGER KRIS A. |
分类号 |
B23K1/018;H01L21/56;H01L21/60;H05K3/34;H05K13/04;(IPC1-7):B23K1/00;B23K15/00;B23K16/00 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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